Mikrotik -Interface – Bonding – Hinweise – Notes

Mikrotik – Interface – Bonding – Hinweise

Im folgenden die wichtigsten Hinweise und Warnings aus dem Bonding-Artikel im Mikrotik Wiki

Bonding ist eine Technologie, die es ermöglicht, mehrere Ethernet-ähnliche Schnittstellen zu einer einzigen virtuellen Verbindung zusammenzufassen, wodurch höhere Datenraten erzielt und eine Ausfallsicherheit gewährleistet wird.

https://wiki.mikrotik.com/wiki/Manual:Interface/Bonding

Hinweise – Notes:

  • Menu – Summary:
    • Note: Interface bonding does not create a interface with a larger link speed. Interface bonding creates a virtual interface that can load balance traffic over multiple interfaces. More details can be found in the LAG interfaces and load balancing page.
  • Menu – Quick Setuo Guide:
    • Note: bonding interface needs a couple of seconds to get connectivity with its peer.
  • Menu – Link Monitoring:
    • Note: For ARP monitoring to work properly it is not required to have any IP address on the device, ARP monitoring will work regardless of the IP address that is set on any interface.
  • Menu – Bonding modes:
    • Note: layer-3-and-4 transmit hash mode is not fully compatible with LACP. More details can be found in https://www.kernel.org/doc/Documentation/networking/bonding.txt
    • Note: On some switches you need to set correct link aggregation protocol, to make balancing work in both directions
    • Note: ARP monitoring in this mode will not work correctly if both routers are directly connected. In such setups mii monitoring must be used or a switch should be put between routers.
  • Property Description
    • link-monitoring (arp | mii | none; Default: mii)
        • arp – uses Address Resolution Protocol to determine whether the remote interface is reachable
        • mii – uses Media Independent Interface to determine link status. Link status determination relies on the device driver.
        • none – no method for link monitoring is used.Method to use for monitoring the link (whether it is up or down)
        • Note: some bonding modes require specific link monitoring to work properly.
  • Notes:
    • Link failure detection and failover is working significantly better with expensive network cards, for example, made by Intel, then with more cheap ones. On Intel cards for example, failover is taking place in less than a second after link loss, while on some other cards, it may require up to 20 seconds. Also, the Active load balancing (mode=balance-alb) does not work on some cheap cards. L2 MTU of bonding interface is determined by taking smallest value of all slaves.

Warnings:

  • Menu – Link Monitoring
    • Warning: When ARP monitoring is used, bonding slaves will send out ARP requests without a VLAN tag, even if an IP address is set on a VLAN interface in the same subnet as the arp-ip-targets

See also:

Dieser Beitrag wurde unter Bonding abgelegt und mit , , , , , , , , , , , , , , verschlagwortet. Setze ein Lesezeichen auf den Permalink.

Schreibe einen Kommentar

Deine E-Mail-Adresse wird nicht veröffentlicht. Erforderliche Felder sind mit * markiert.